UBM (Under Bump Metallization)

The bond pad redistribution layer (polyimide 1) and the under bump

Epithas® Ni/Au Process for Under Bump Metallization: Copper - Tech Knowledge : ידע-טק

FlipChip

Flip chip bumping technology—Status and update - ScienceDirect

A new failure mechanism of electromigration by surface diffusion of Sn on Ni and Cu metallization in microbumps

Interconnection in IC Assembly - ppt video online download

Figure 2 from Under Bump Metallurgy (UBM)-a technology review for flip chip packaging

PDF] CrCu based UBM (under bump metallization) study with electroplated Pb/63Sn solder bumps - interfacial reaction and bump shear strength

All about Fan-In & Fan-Out Wafer-Level Package (WLP)

15544557.ppt

Figure 6 from Under Bump Metallurgy (UBM)-a technology review for flip chip packaging

Insights From the Leading Edge: IFTLE 37 Advanced Packaging at Singapores EPTC