Determining Thermal Conductivity and Coefficient of Thermal Expansion (CTE) of Epoxy Mold Compounds

Panel Process for Fan Out Wafer Level Packaging: Part Three, Film Epoxy Mold Compounds - Polymer Innovation Blog

Polymers, Free Full-Text

Thermal Behavior of Thermoset Molding Compounds Used to Encapsulate IC Devices

UL-approved Class B Epoxy Mold Compounds for Coil and Bobbin Encapsulation

List of Henkel Epoxy Coating Powders and Molding Compounds sold to SolEpoxy

Contact-free thermal expansion measurement of very soft elastomers using digital image correlation - ScienceDirect

Comparing Power Transistors Operating at HighTemperature Tj200C Knowing the Transistors in Designs - Technical Articles

PDF) Effects of Molding Compound Cure on Warpage of Electronic Packages

The tunable negative thermal expansion covering a wide temperature range around room temperature in Sn, Mn co-substituted Mn 3 ZnN - Dalton Transactions (RSC Publishing) DOI:10.1039/D0DT02221G

Distributed internal strain measurement of the fluid-solid state coefficients of thermal expansion below the glass transition temperature during a composite manufacturing process - Ilaria Poggetti, Jack Dyson, Daniel Martínez Sánchez, Gianni Albertini

Epoxies with Low Coefficient of Thermal Expansion

High thermal conductivity of boron nitride filled epoxy composites